标准摘要
[中文适用范围]： IEC 61188 的这一部分规定了回流焊接工艺中使用的两侧带有“J”形引线的小外形集成电路（SOJ 元件）的元件和焊盘图案尺寸。还涵盖了 SOJ 设备的基本构造。第 4 条列出了用于确定焊盘图案尺寸的公差和目标焊点尺寸。 [外文原描述]： IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.
英文名称Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides