标准摘要
[中文适用范围]: IEC 61188 的这一部分提供了有关用于四个侧面具有鸥翼引线的电子元件表面附着的焊盘图案几何形状的信息。本文提供的信息的目的是提供表面安装焊盘图案的适当尺寸、形状和公差,以确保适当的焊料填角有足够的面积,并且还允许对这些焊点进行检查、测试和返工。每个条款都包含一组特定的标准,以便所提供的信息保持一致,提供有关元件、元件尺寸、焊点设计和焊盘图案尺寸的信息。焊盘图案尺寸基于数学模型,该模型为将焊点连接到印刷板建立了平台。现有模型创建了一个平台,能够建立用于制造该接头的可靠焊料合金(无铅、锡铅等)。根据焊料合金的不同,回流焊的工艺要求也不同,应进行分析,以便工艺在该温度以上有足够的时间以形成可靠的冶金结合。 [外文原描述]: IEC 61188-5-5:2007 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. This publication is to be read in conjunction with IEC 61188-5-1 :2002 .
英文名称Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides