标准摘要
[中文适用范围]： IEC 61188 的这一部分规定了电路板上焊接表面的要求。这包括表面安装元件的焊盘和焊盘图案，以及通孔安装元件的可焊接孔配置。这些要求基于焊料 [外文原描述]： IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
英文名称Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards