标准摘要
[中文适用范围]： 本部分IEC 61188规定了基于IEC 61191-1和IEC 61191-3的焊接接头要求，用于通过焊接安装带引线组件的电路板上的焊盘和焊盘图案的要求。本部分IEC 61188规定了电路板上的焊接表面要求。这包括表面安装组件的焊盘和焊盘图案，以及通孔安装组件的可焊孔配置。这些要求基于IEC 61191-1、IEC 61191-2、IEC 61191-3和IEC 61191-4的焊接接头要求。 [外文原描述]： IEC 61188-6-3:2024 specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of IEC 61191-1 and IEC 61191-3. This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through hole mounted components. These requirements are based on the solder joint requirements of IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4. This first edition partially cancels and replaces the IEC 61188-5 series of International Standards. The significant technical changes with respect to the previous edition are listed in the Introduction and further detailed information and calculations can be found in Annex A.
英文名称Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)