标准摘要
[中文适用范围]： IEC 61188的这一部分从焊盘图案设计的角度规定了SMD尺寸图的通用要求。本文件的目的是防止由于缺乏信息和/或误用 SMD 外形图信息而导致的焊盘图案设计问题，并提高 IEC 61188 系列的利用率。本文件适用于半导体器件和电气元件的SMD。 [外文原描述]： IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design. The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.
英文名称Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design