标准摘要
[中文适用范围]： IEC 61189 的这第一部分是一个测试方法目录，代表了可用于测试用于制造互连结构（印刷电路板）和组件的材料的测试方法和程序。 [外文原描述]： This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies. This consolidated version consists of the first edition (1997) and its amendment 1 (2001). Therefore, no need to order amendment in addition to this publication.
英文名称Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology