标准摘要
[中文适用范围]： 本国际标准规定了电气材料、印刷板及其他互连结构和组装件沿Z轴膨胀的试验方法。它适用于各种基材及印刷电路板在不同条件下的膨胀行为测试。 [外文原描述]： IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).
英文名称Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards