标准摘要
[中文适用范围]： IEC 61189-2-804:2023 指定了一种使用热机械分析仪 (TMA) 确定基材和印制板分层时间的测试方法。用于该评估的温度通常为260℃、288℃和300℃，但不限于这些值。 [外文原描述]： IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.
英文名称Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300