标准摘要
[中文适用范围]： 本部分IEC 61189描述了用于表征由热源（如功率器件）、连接材料（如焊料）和带有电极的介电层组成的组件的热阻的热瞬态方法。该方法适用于确定材料和组装方法的热阻，以及优化到散热器的热通量。 注：该方法不用于测量和指定介电材料的热阻值。为此目的，存在其他标准。示例见附录A。 [外文原描述]： IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink. NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
英文名称Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method