标准摘要
[中文适用范围]： IEC 61189-3-302:2025描述了一种利用计算机断层扫描（CT）检测未插件电路板镀层缺陷的方法。本文件适用于金属化孔的无损检测。 [外文原描述]： IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT). This document is applicable to non-destructive testing of metallized holes.
英文名称Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)