标准摘要
[中文适用范围]： IEC 61189 的这一部分是测试方法目录，代表可应用于测试印制板组件的方法和程序。 IEC 61189的这一部分重点介绍基于现有IEC 61189-5和IEC 61189-6的焊膏测试方法。此外，它还包括无铅焊接用焊膏的测试方法。 [外文原描述]： IEC 61189-5-3:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering. This publication is to be read in conjunction with IEC 61189-1:1997 , IEC 61189-2:2006 and IEC 61189-3:2007 .
英文名称Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies