标准摘要
[中文适用范围]： 本文档规定了使用细焊料颗粒的焊膏（以下简称焊膏）特性测试方法。本文件适用于IEC 61190-1-2规定的6型、7型或使用更细颗粒尺寸的焊料颗粒制成的焊膏。此类焊膏用于在电子或通信设备等中装备精细布线（例如，最小导线宽度和最小导线间隙为60 µm或更小）的高密度印刷电路板上连接布线和组件。本文件中焊膏特性的测试方法考虑了细尺寸焊料颗粒产生的表面活化力对测试结果的潜在影响。 [外文原描述]： IEC 61189-5-301:2021 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste). This document is applicable to the solder paste using fine solder particle such as type 6, type 7 specified in IEC 61190-1-2 or finer particle sizes. This type of solder paste is used for connecting wiring and components in high-density printed circuit boards which are used in electronic or communication equipment and such, equipping fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 µm or less). Test methods for the characteristics of solder paste in this document are considering the effect of surface activation force due to the fine sized solder particles which could affect the test result by existing test methods.
英文名称Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles