标准摘要
[中文适用范围]： IEC 61189 的这一部分是测试方法目录，代表可应用于测试印制板组件的方法和程序。 IEC 61189的这一部分重点关注基于现有IEC 61189-5和IEC 61189-6的焊料合金@助焊剂和非助焊剂实心焊丝@的测试方法。此外，它还包括焊料合金、助焊剂和非助焊剂实心焊丝以及无铅焊接的测试方法。 [外文原描述]： IEC 61189-5-4:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods for solder alloys, fluxed and non-fluxed solid wire, and for lead free soldering. This publication is to be read in conjunction with IEC 61189-1:1997 , IEC 61189-2:2006 and IEC 61189-3:2007 .
英文名称Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies