标准摘要
[中文适用范围]： 本文件规定了在应用锡铅（Pb）共晶或近共晶合金或无铅合金时，安装在有机刚性印刷电路板上的元件的回流焊接性能测试方法、有机刚性印刷电路板的回流耐热性测试方法，以及有机刚性印刷电路板焊盘的焊接性能测试方法。本文件涵盖的印刷电路板材料为环氧树脂织造E玻纤层压板，具体规格见IEC 61249-2。本文件的目的是确保焊点和印刷电路板的焊盘具有焊接性能，并提供测试方法以确保印刷电路板能够承受焊接过程中暴露的热负荷。本文件涵盖表1中列出的Tg 1、Tg 2、Tg 3、Tg 4、Tg 5和Tg 6测试项目。 [外文原描述]： IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys. The printed boards materials for this organic rigid printed boards are epoxide woven E-glass laminated sheets that are specified in IEC 61249-2 (all parts). The objective of this document is to ensure the soldering ability of the solder joint and of the lands of the printed boards. In addition, test methods are provided to ensure that the printed boards can resist the heat load to which they are exposed during soldering.
英文名称Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards