标准摘要
[中文适用范围]： IEC 61190 的这一部分规定了电子装配中用于制造高质量电子互连的焊膏的表征和测试的一般要求。该标准规定了质量控制文件，无意与制造过程中的材料性能直接相关。有关助焊剂特性、质量控制以及助焊剂和含助焊剂材料的采购文档的相关信息，请参见 IEC 61190-1-1。 [外文原描述]： Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).
英文名称Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly