标准摘要
[中文适用范围]： IEC 61190 的这一部分规定了电子装配中用于实现高质量电子互连的焊膏的表征和测试的一般要求。该标准作为质量控制文件，并不与制造过程中材料的性能直接相关。有关助焊剂和含助焊剂材料的助焊剂特性、质量控制和采购文档的相关信息，请参见 IEC 61190-1-1。 [外文原描述]： IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.
英文名称Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly