标准摘要
[中文适用范围]： 本部分 IEC 61190 规定了用于电子组装中制造高质量电子互连的焊膏的表征和测试的一般要求。本标准作为质量控制文件，并非旨在直接涉及材料在制造过程中的性能。关于焊膏和含flux 材料的 flux 表征、质量控制和采购文档的的相关信息，可参见 IEC 61190-1-1。 [外文原描述]： IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition: a) modification of the solder powder size in Table 2; b) addition of the information of "Reflow condition and profile" in Annex B; c) addition of a new Annex C.
英文名称Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly