标准摘要
[中文适用范围]： IEC 61190 的这一部分规定了电子级焊料合金、助焊剂和非助焊剂焊条、带状焊料和粉末焊料（焊膏除外）、电子焊接应用以及特殊电子级焊料的要求和测试方法。有关焊料合金和助焊剂的通用规格，请分别参见 ISO 9453、ISO 9454-1 和 ISO 9454-2。本标准是一份质量控制文件，无意与制造过程中的材料性能直接相关。特殊电子级焊料包括所有不完全符合本文列出的标准焊料合金和焊料材料要求的焊料。特殊焊料的一些例子包括阳极、锭、预成型件、带钩眼端的棒、多合金焊粉等。 [外文原描述]： Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders. This standard is a quality control document (not intended to relate directly to the material performance in the manufacturing process).
英文名称Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications