标准摘要
[中文适用范围]： IEC61190的这一部分规定了电子级焊料合金、助焊剂和非助焊剂棒、带、粉末焊料和焊膏、电子焊接应用和“特殊”电子级焊料的要求和测试方法。有关焊料合金和助焊剂的通用规格，请参阅 ISO 9453、ISO 9454-1 和 ISO 9454-2。本标准是一份质量控制文件，无意与材料在制造过程中的性能直接相关。特殊电子级焊料包括所有不完全符合本文列出的标准焊料合金和焊料材料要求的焊料。特殊焊料的例子包括阳极、锭、预成型件、带钩眼端的棒、多合金焊粉等。 [外文原描述]： IEC 61190-1-3:2007 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an amendment to Table B.1 concerning lead-free solder alloys.
英文名称Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications