标准摘要
[中文适用范围]： IEC 61190 的这一部分规定了电子级焊料合金@用于助焊剂和非助焊剂条@带@粉末焊料和焊膏@用于电子焊接应用以及“特殊”电子级焊料的要求和测试方法。焊料合金和助焊剂的通用规格@参见 ISO 9453。本文件是质量控制文件，无意与制造过程中材料的性能直接相关。特殊电子级焊料包括所有不完全符合此处列出的标准焊料合金和焊料材料的要求。特殊焊料的示例包括阳极@锭@预成型件@带钩眼端的棒@和多合金焊粉。 [外文原描述]： IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition: a) The maximum impurity level of Pb has been revised and the table of lead free solder alloys includes some additional lead free solder alloys.
英文名称Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications