标准摘要
[中文适用范围]： IEC 61191 的这一部分规定了使用表面贴装和相关组装技术生产优质焊接互连和组件的材料、方法和验证标准的要求。 IEC 61191 的这一部分还包括对良好制造工艺的建议。 [外文原描述]： IEC 61191-1:2013 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. It also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition: - reference standard IEC 61192-1 has been replaced by IPC-A-610; - some of the terminology has been updated; - references to IEC standards have been corrected; - the use of lead-free alloys in the assembly have been added.
英文名称Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies