标准摘要
[中文适用范围]： 本规范规定了表面安装焊接连接的要求。这些要求适用于完全表面安装的组件或包含其他相关技术（例如通孔、芯片安装、端子安装等）的组件的表面安装部分。 [外文原描述]： Prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).
英文名称Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies