标准摘要
[中文适用范围]： IEC 61191 的这一部分给出了表面贴装焊接连接的要求。这些要求适用于完全表面安装的组件或包含其他相关技术（例如通孔、芯片安装、端子安装等）的组件的表面安装部分。 [外文原描述]： IEC 61191-2:2013 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition: - IPC-A-610 on workmanship has been included as a normative reference; - some of the terminology used in the document has been updated; - references to IEC standards have been corrected; - the use of lead-free solder paste and plating are addressed.
英文名称Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies