标准摘要
[中文适用范围]： IEC 61191 的这一部分规定了引线和孔焊接组件的要求。这些要求适用于完全使用通孔安装技术 (THT) 的组件，或包含其他相关技术（即表面安装、芯片安装、端子安装）的组件的 THT 部分。 [外文原描述]： IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting). This edition includes the following significant technical changes with respect to the previous edition: a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.
英文名称Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies