标准摘要
[中文适用范围]： IEC 61191的本部分规定了热循环寿命@尺度上的空洞评估标准以及使用X射线观察的空洞测量方法。 IEC 61191的本部分适用于焊接在板上的BGA和LGA焊点中产生的空洞。 IEC 61191 的这一部分不适用于组装在电路板上之前的 BGA 封装本身。除BGA和LGA外，该标准还适用于具有通过熔化和再凝固@制成的接头的器件，例如倒装芯片器件和多芯片模块@。本标准不适用于器件和电路板之间有底部填充的接头或器件封装内的焊点。本标准适用于尺寸为 10 ??焊接接头@中产生的数百微米，但不适用于尺寸小于10 ??的较小空隙（通常@平面微空隙）在直径上。本标准旨在用于评估目的并适用于？研究研究@？离线生产过程控制和？装配的可靠性评估。 [外文原描述]： IEC 61191-6:2010 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board. This standard is applicable also to devices having joints made by melt and re-solidification, such as flip chip devices and multi-chip modules, in addition to BGA and LGA. This standard is not applicable to joints with under-fill between a device and a board, or to solder joints within a device package. This standard is applicable to macrovoids of the sizes of from 10 µm to several hundred micrometres generated in a soldered joint, but is not applicable to smaller voids (typically, planar microvoids) with a size of smaller than 10 µm in diameter. This standard is intended for evaluation purposes and is applicable to research studies, off-line production process control and reliability assessment of assembly.
英文名称Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method