标准摘要
[中文适用范围]： 规定了印刷电路板和附着在有机基材表面的类似层压板上焊接电子组件的工艺一般要求。定义了预加工中良好工艺和实践的要求和指南 [外文原描述]： Specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates. Defines requirements and guidelines for good workmanship and practice in the preparation, soldering, inspection and testing of electronic and electrical assemblies. Enables achievement of high yields and high product quality through process control in production.
英文名称Workmanship requirements for soldered electronic assemblies - Part 1: General