标准摘要
[中文适用范围]： 规定了有机基板、印刷板以及附着在无机基板表面的类似层压板上焊接表面安装电子组件和多芯片模块的工艺要求。适用于装配体 [外文原描述]： Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.
英文名称Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies