标准摘要
[中文适用范围]： 规定了有机基板、印刷板以及附着在无机基板表面的类似层压板上的通孔安装焊接组件的一般工艺要求。它适用于完全通过的组件 [外文原描述]： Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.
英文名称Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies