标准摘要
[中文适用范围]： IEC 61193 的这一部分定义了焊接印刷板组件缺陷的注册和分析方法。所描述的方法可以有效比较产品、流程和生产地点之间的性能，并可以作为总体质量改进的基础。该标准规定了两类缺陷数据收集。类别 1 ppm 数据：此类别提供用于注册目的的数据，旨在实现装配操作的整体性能比较。第 2 类 ppm 数据：此类别提供用于单个子过程评估、分析和控制目的的数据。 [外文原描述]： Defines methods of registration and analysis of defects on soldered printed board assemblies. These methods are described to allow effective comparison of performance between products, processes and production locations, and can serve as a basis for general quality improvement.
英文名称Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies