IEC 61249-5-1:1995 现行

互连结构用材料 第5部分:有或无涂层的导电箔和薄膜分规范集 第1节:铜箔(用于生产覆铜基材)

标准摘要

[中文适用范围]: 规定了用于制造覆铜层压板和用于制造印制板的覆铜柔性材料的铜箔的性能要求。 [外文原描述]: Gives requirements for properties of copper foil intended for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used in the manufacture of printed boards.
英文名称Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

替代关系

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