电气元件.可靠性.转换用故障率和应力模型的参考条件

[中文适用范围]： 本文件提供了关于如何使用故障率数据进行电气元件可靠性预测的指导。 本文件介绍的方法使用了参考条件的概念，这些条件是大多数应用中元件所承受应力的典型数值。 参考条件是有用的，因为它们是通过考虑实际运行条件的应力模型计算任何条件下故障率的基础。参考条件提供了一个已知的标准基础，可以根据与参考条件不同的环境来修改故障率。每个用户可以使用本文件中定义的参考条件或使用自己的条件。当使用参考条件下的故障率时，可以在早期设计阶段做出现实的可靠性预测。 本文描述的应力模型是通用的，可以作为在需要时将给定参考条件下的故障率数据转换为实际运行条件的基础，这简化了预测方法。故障率数据的转换仅在组件的指定功能限制内是允许的。 本文件还提供了如何构建组件故障数据数据库的指导，以提供可以与包含的应力模型一起使用的故障率。规定了故障率数据的参考条件，以便可以在统一的基础上比较来自不同来源的数据。如果故障率数据符合本文件的规定，则可以省略有关指定条件的额外信息。 本文件不提供组件的基本故障率，而是提供了允许将通过其他方式获得的故障率从一个运行条件转换为另一个运行条件的模型。 本文件中描述的预测方法假设部件在其使用寿命内使用。本文件中的方法具有一般应用，但特别适用于第6至20条和第1.2条中定义的组件类型的选择。 [外文原描述]： IEC 61709:2017 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 61709:2017 gives guidance on the use of failure rate data for reliability prediction of electric components used in equipment. The method presented in this document uses the concept of reference conditions which are the typical values of stresses that are observed by components in the majority of applications. Reference conditions are useful since they provide a known standard basis from which failure rates can be modified to account for differences in environment from the environments taken as reference conditions. Each user can use the reference conditions defined in this document or use their own. When failure rates stated at reference conditions are used it allows realistic reliability predictions to be made in the early design phase. The stress models described herein are generic and can be used as a basis for conversion of failure rate data given at these reference conditions to actual operating conditions when needed and this simplifies the prediction approach. Conversion of failure rate data is only possible within the specified functional limits of the components. This document also gives guidance on how a database of component failure data can be constructed to provide failure rates that can be used with the included stress models. Reference conditions for failure rate data are specified, so that data from different sources can be compared on a uniform basis. If failure rate data are given in accordance with this document then additional information on the specified conditions can be dispensed with. This document does not provide base failure rates for components – rather it provides models that allow failure rates obtained by other means to be converted from one operating condition to another operating condition. The prediction methodology described in this document assumes that the parts are being used within its useful life. The methods in this document have a general application but are specifically applied to a selection of component types as defined in Clauses 6 to 20 and I.2. This third edition cancels and replaces the second edition, published in 2011. This edition constitutes a technical revision. This third edition is a merger of IEC 61709:2011 and IEC TR 62380:2004. This edition includes the following significant technical changes with respect to the previous edition: addition of 4.5 Components choice, 4.6 Reliability growth during the deployment phase of new equipment, 4.7 How to use this document, and of Clause 19 Printed circuit boards (PCB) and Clause 20 Hybrid circuits with respect to IEC TR 62380; addition of failure modes of components in Annex A; modification of Annex B, Thermal model for semiconductors, adopted and revised from IEC TR 62380; modification of Annex D, Considerations on mission profile; modification of Annex E, Useful life models, adopted and revised from IEC TR 62380; revision of Annex F (former B.2.6.4), Physics of failure; addition of Annex G (former Annex C), Considerations for the design of a data base on failure rates, complemented with parts of IEC 60319; addition of Annex H, Potential sources of failure rate data and methods of selection; addition of Annex J, Presentation of component reliability data, based on IEC 60319. The contents of the corrigendum of October 2019 have been included in this copy. Keywords: failure rate data, reliability prediction of electric components