电子元器件.可靠性.转换用故障率和应力模型的基准条件

[中文适用范围]： 本文件为使用故障率数据来预测设备中使用的电气元件的可靠性提供了指导。本文件中提出的方法使用参考条件的概念，这是大多数应用中组件观察到的应力的典型值。参考条件很有用，因为它们提供了已知的标准基础，可以根据该标准基础修改故障率，以考虑环境与作为参考条件的环境之间的差异。每个用户可以使用本文档中定义的参考条件或使用自己的条件。当使用参考条件下规定的故障率时，可以在早期设计阶段做出实际的可靠性预测。本文描述的应力模型是通用的，并且可以用作在需要时将这些参考条件下给出的故障率数据转换为实际操作条件的基础，并且这简化了预测方法。故障率数据的转换只能在组件的指定功能限制内进行。本文档还提供了有关如何构建组件故障数据数据库以提供可与所包含的压力模型一起使用的故障率的指导。规定了故障率数据的参考条件，以便不同来源的数据可以在统一的基础上进行比较。如果根据本文件给出故障率数据，则可以省去有关指定条件的附加信息。本文档不提供组件的基本故障率，而是提供模型，允许通过其他方式获得的故障率从一种操作条件转换为另一种操作条件。本文档中描述的预测方法假设零件在其使用寿命内使用。本文档中的方法具有一般应用，但特别适用于第 6 条至第 20 条和 I.2 中定义的一系列组件类型。 [外文原描述]： IEC 61709:2017 gives guidance on the use of failure rate data for reliability prediction of electric components used in equipment. The method presented in this document uses the concept of reference conditions which are the typical values of stresses that are observed by components in the majority of applications. Reference conditions are useful since they provide a known standard basis from which failure rates can be modified to account for differences in environment from the environments taken as reference conditions. Each user can use the reference conditions defined in this document or use their own. When failure rates stated at reference conditions are used it allows realistic reliability predictions to be made in the early design phase. The stress models described herein are generic and can be used as a basis for conversion of failure rate data given at these reference conditions to actual operating conditions when needed and this simplifies the prediction approach. Conversion of failure rate data is only possible within the specified functional limits of the components. This document also gives guidance on how a database of component failure data can be constructed to provide failure rates that can be used with the included stress models. Reference conditions for failure rate data are specified, so that data from different sources can be compared on a uniform basis. If failure rate data are given in accordance with this document then additional information on the specified conditions can be dispensed with. This document does not provide base failure rates for components – rather it provides models that allow failure rates obtained by other means to be converted from one operating condition to another operating condition. The prediction methodology described in this document assumes that the parts are being used within its useful life. The methods in this document have a general application but are specifically applied to a selection of component types as defined in Clauses 6 to 20 and I.2. This third edition cancels and replaces the second edition, published in 2011. This edition constitutes a technical revision. This third edition is a merger of IEC 61709:2011 and IEC TR 62380:2004. This edition includes the following significant technical changes with respect to the previous edition: addition of 4.5 Components choice, 4.6 Reliability growth during the deployment phase of new equipment, 4.7 How to use this document, and of Clause 19 Printed circuit boards (PCB) and Clause 20 Hybrid circuits with respect to IEC TR 62380; addition of failure modes of components in Annex A; modification of Annex B, Thermal model for semiconductors, adopted and revised from IEC TR 62380; modification of Annex D, Considerations on mission profile; modification of Annex E, Useful life models, adopted and revised from IEC TR 62380; revision of Annex F (former B.2.6.4), Physics of failure; addition of Annex G (former Annex C), Considerations for the design of a data base on failure rates, complemented with parts of IEC 60319; addition of Annex H, Potential sources of failure rate data and methods of selection; addition of Annex J, Presentation of component reliability data, based on IEC 60319. The contents of the corrigendum of October 2019 have been included in this copy. Keywords: failure rate data, reliability prediction of electric components