标准摘要
[中文适用范围]: 本国际标准给出了编制元件规格时使用的工艺条件和相关测试条件的参考集。目标是可以使用常见的焊接工艺将符合该标准和相应元件标准的不同性质(无源、有源)的 SMD 组装并安装在基板上。为此,应根据组件设计过程的严重性对组件进行分类。本标准适用于 IEC 系统涵盖的所有需要对其表面安装应用进行评估的电子元件。 [外文原描述]: Applies to all electronic components covered by the IEC system which require an assessment with respect to their application to surface mounting. Gives a reference set of process conditions and related test conditions to be used when complying component specifications.
英文名称Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)