表面安装技术.第1部分:表面安装元件(SMDS)规范的标准方法

[中文适用范围]： 本国际标准提供了在编制用于表面贴装技术的电子元件的元件规格时使用的工艺条件和相关测试条件的参考集。 [外文原描述]： IEC 61760-1:2006-04(en-fr) gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology. The main changes with regard to the previous edition concern: - requirements related to lead-free soldering; - extension of the scope to include also components mounted by gluing; - direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat; - classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.