表面贴装技术 - 第1部分:表面贴装元件（Smds）规范的标准方法

[中文适用范围]： 本部分IEC 61760定义了用于表面贴装技术的电子组件规格的要求。为此，它规定了在编制组件规格时需要考虑的过程条件和相关测试条件参考集。本文档的目标是确保各种各样的表面贴装器件 (SMD) 能够承受组装过程中的相同放置、安装和后续过程（例如清洁、检查）。本文档定义了需要包含在任何 SMD 组件的一般、分部分或详细规格中的测试和要求。此外，本文档为组件用户和制造商提供了一组表面贴装技术中使用的典型过程条件参考集。本文档中的部分组件规格要求也适用于引线旨在安装在电路板上的组件。适用于这些情况的情况在相关子条款中指明。 [外文原描述]： IEC 61760-1:2020 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications. The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that need to be part of any SMD component's general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology. Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board. Cases for which this is appropriate are indicated in the relevant subclauses. This edition includes the following significant technical changes with respect to the previous edition: a) inclusion of additional mounting methods: conductive glue bonding, sintering and solderless interconnection.