标准摘要
[中文适用范围]： 本国际标准描述了表面安装器件 (SMD) 的运输和存储条件，为了实现有源和无源表面安装器件的无故障处理，必须满足这些条件。 （不考虑印刷板的条件。）该标准的目的是确保SMD 用户接收和存储可以进一步处理（例如定位、焊接）的产品，而不影响质量和可靠性。 SMD 运输和储存不当可能会导致劣化并导致组装问题，例如可焊性差、分层和“爆米花”。 [外文原描述]： IEC 61760-2:2007 describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive (Conditions for printed boards are not taken into consideration). The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". This second edition cancels and replaces the first edition, published in 1998, and constitutes a technical revision. The standard was updated and editorially revised.
英文名称Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide