标准摘要
[中文适用范围]： 本文档规定了表面贴装器件（SMD）的运输和储存条件，旨在确保能够顺利进行无故障的表面贴装处理，包括有源和无源器件。（未考虑印刷电路板的条件。）本文件的目标是确保SMD用户接收和储存的产品能够在不影响质量和可靠性的情况下进一步加工（例如定位、焊接）。不恰当的运输和储存会导致SMD性能恶化，并导致组装问题，如可焊性差、分层和“爆米花”效应。 [外文原描述]： IEC 61760-2:2021 specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.) The object of this document is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". Cross-references for references from this edition 3 to the previous edition 2 of this document are listed in Annex X of this document.
英文名称Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide