表面贴装技术. 第3部分: 通孔回流(THR)焊接用组件规范的标准方法

[中文适用范围]： IEC 61760 的这一部分提供了在编制用于通孔回流焊接技术的电子元件规格时使用的一组参考要求、工艺条件和相关测试条件。本文件的目的是 [外文原描述]： IEC 61760-3:2021 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology. The object of this document is to ensure that components with leads intended for through-hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this document defines test and requirements that need to be part of any component generic, sectional or detail specification, when through-hole reflow soldering is intended. Furthermore, this document provides component users and manufacturers with a reference set of typical process conditions used in through-hole reflow soldering technology. This edition includes the following significant technical changes with respect to the previous edition: a) change position tolerance requirement (0,4 mm maximum to between 0,2 mm and 0,4 mm); b) introduce through-hole vacant method as a solder paste supply method.