标准摘要
[中文适用范围]： 本部分 IEC 61760 规定了与焊接热相关的湿度敏感器件的湿度敏感等级分类，以及包装、标签和处理的条款。 本部分 IEC 61760 将分类和包装方法扩展到那些现有标准不要求或不适用于的组件。对于这些情况，本标准引入了额外的湿度敏感等级和一种替代的包装方法。 本标准适用于回流焊接的器件，如表面贴装器件，包括特定的通孔器件（器件供应商已特别记录支持回流焊接），但不适用于半导体器件和用于流动（波）焊接的器件。 [外文原描述]： IEC 61760-4:2015+A1:2018 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering. This consolidated version consists of the first edition (2015) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.
英文名称Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices