表面贴装技术 - 第4部分:水分敏感器件的分类 包装 标签和处理

[中文适用范围]： IEC 61760 的这一部分规定了湿气敏感设备的分类，即与焊接热@相关的湿气敏感性级别以及包装@标签和处理的规定。 IEC 61760 的这一部分将分类和封装方法扩展到当前现有标准不需要或不合适的组件@。对于这种情况，该标准引入了额外的湿度敏感性级别和替代包装方法。本标准适用于用于回流焊接的设备@如表面贴装设备@包括特定的通孔设备（其中设备供应商专门记录了对回流焊接的支持）@但不适用于？半导体器件@？用于流动（波峰）焊接的设备。注：本标准的背景及其与当前现有标准@（例如 IEC 60749-20 或 J-STD-020 和 J-STD-033@）的关系在引言中进行了描述。 [外文原描述]： IEC 61760-4:2015 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering.