表面贴装技术 - 第4部分：湿敏器件的分类、包装、标签和处理

[中文适用范围]： IEC 61760-4:2026 标准包含该标准的正式国际版本及其修订对照版本（Redline）。修订对照版本仅提供英文版，便于用户快速、便捷地比对正式 IEC 标准与其前一版本之间的所有变更。 IEC 61760-4:2026 规定了与焊接热应力相关的湿敏器件分类等级，并就包装、标识及操作提出了相应要求。该标准将现有的分类与包装方法扩展适用于那些现行标准尚未覆盖或不适宜的场景。针对此类情况，本标准引入了额外的湿敏等级，并提供了替代性的包装方法。 本文件适用于拟采用回流焊接工艺的设备，包括表面贴装器件，以及特定通孔插装器件（前提是器件供应商已明确提供对回流焊接的支持），但不适用于半导体器件及用于波峰焊接的器件。注：本文件的背景及其与现行相关标准（如 IEC 60749-20、J-STD-020F 和 J-STD-033）的关系详见引言部分。 与前一版本相比，本版本包含以下重大技术变更：a) 内容已更新，以涵盖新修订版 J-STD-020F 和 IEC 60068-2-58 中规定的分类条件。 [外文原描述]： IEC 61760-4:2026 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 61760-4:2026 specifies the classification of moisture sensitive device into moisture sensitivity level related to soldering heat, and provisions for packaging, labelling and handling. It extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases, this document introduces additional moisture sensitivity levels and an alternative method for packaging. This document applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices, and devices for flow (wave) soldering. NOTE Background of this document and its relation to currently existing standards, e.g. IEC 60749‑20 or J-STD-020F and J-STD-033, are described in the Introduction. This edition includes the following significant technical changes with respect to the previous edition: a) The content is updated to cover the classification conditions given in the new editions of J-STD-020F and IEC 60068-2-58.