标准摘要
[中文适用范围]： IEC 61837-2:2018+AMD1:2020+AMD2:2026 CSV 标准规定了用于频率控制与选择的陶瓷封装表面贴装器件（SMD）的标准外形尺寸及引线端子连接要求，该标准基于 IEC 61240:2016。本版与上一版相比，主要技术修订内容包括：- 对图示进行修订，使其与 IEC 61240:2016 图纸中的符号标注保持一致；- 新增七种封装类型，分别为：DCC-6/5032A、DCC-6/3225A、DCC-4/3215C、DCC-6/2016A、DCC-2/2012C、DCC-2/1610C、DCC-4/1210C。由此，第三版标准共收录45种封装类型，详见表1。 [外文原描述]： IEC 61837-2:2018+AMD1:2020+AMD2:2026 CSV deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016. This edition includes the following significant technical changes with respect to the previous edition: - revision of the figures to match the notation of the drawings of IEC 61240:2016; - addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C. As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1.
英文名称Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures