半导体器件.微电机器件.第12部分:使用MEMS结构共振的薄膜材料的弯曲疲劳测试方法

[中文适用范围]： IEC 62047 的这一部分规定了一种利用 MEMS（微机电系统）和微型机械的微型机械结构的共振进行弯曲疲劳测试的方法。本标准适用于尺寸范围为10 ??到 1 000 ??在平面方向上从 1 ??到 100 ??厚度@和测试材料测量长度在1毫米以下@宽度在1毫米以下@和0@1 ??之间和 10 ??在厚度上。 MEMS@微机械@等的主要结构材料具有特殊性@，例如典型尺寸为几微米@通过沉积@制造材料@以及通过包括光刻在内的非机械加工@制造测试件。 MEMS结构通常比宏观结构具有更高的基本谐振频率和更高的强度。为了评估和确保 MEMS 结构的寿命，需要建立具有超高循环（高达 1012）负载的疲劳测试方法。该测试方法的目的是通过共振施加高负载和高循环频率弯曲应力，在短时间内评估微尺度材料的机械疲劳性能。 [外文原描述]： IEC 62047-12:2011 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This standard applies to vibrating structures ranging in size from 10 μm to 1 000 μm in the plane direction and from 1 μm to 100 μm in thickness, and test materials measuring under 1 mm in length, under 1 mm in width, and between 0,1 μm and 10 μm in thickness. The main structural materials for MEMS, micromachine, etc. have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithography. The MEMS structures often have higher fundamental resonant frequency and higher strength than macro structures. To evaluate and assure the lifetime of MEMS structures, a fatigue testing method with ultra high cycles (up to 1012) loadings needs to be established. The object of the test method is to evaluate the mechanical fatigue properties of microscale materials in a short time by applying high load and high cyclic frequency bending stress using resonant vibration.