半导体装置.微电机装置.第14部分:金属薄膜材料的成型极限测量方法

[中文适用范围]： IEC 62047的这一部分描述了测量厚度范围为0@5≤金属薄膜材料的成形极限的定义和程序。到300??。本文描述的金属膜材料通常用于电子元件@MEMS和微型器件。当 MEMS 中使用的金属薄膜材料（参见 IEC 62047-1:2005 的 2.1.2）通过压印@等成型工艺制造时，有必要预测材料失效，以提高组件的可靠性。通过这一预测，通过成型工艺制造 MEMS 组件的效率也可以得到提高，因为可以缩短产品开发周期，从而降低制造成本。本标准提出了压印过程中材料失效的预测方法之一。 [外文原描述]： IEC 62047-14:2012 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 μm to 300 μm. The metallic film materials described herein are typically used in electric components, MEMS and micro-devices. When metallic film materials used in MEMS (see 2.1.2 of IEC 62047-1:2005) are fabricated by a forming process such as imprinting, it is necessary to predict the material failure in order to increase the reliability of the components. Through this prediction, the effectiveness of manufacturing MEMS components by a forming process can also be improved, because the period of developing a product can be reduced and manufacturing costs can thus be decreased. This standard presents one of the prediction methods for material failure in imprinting process.