标准摘要
[中文适用范围]： 本标准规定了长宽在1mm以下、厚度在10μm以下的薄膜材料的拉伸试验方法，这些薄膜材料是微机电系统（MEMS）、微型机械和类似器件的主要结构材料。 MEMS、微机械和类似设备的主要结构材料具有特殊的特征，例如典型尺寸在几微米量级、通过沉积制造材料、以及使用蚀刻和光刻通过非机械加工制造测试件。本国际标准规定了测试方法，可以保证与特殊特性相对应的准确性。 [外文原描述]： Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.
英文名称Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials