标准摘要
[中文适用范围]： IEC 62047 的这一部分指定了拉伸测试方法，用于测量粘合在非导电柔性基板上的导电薄微机电系统 (MEMS) 材料的机电性能。柔性基板上的导电薄膜结构广泛应用于MEMS@消费产品@和柔性电子产品。由于界面相互作用，柔性基板上的薄膜的电学行为不同于独立薄膜和基板的电学行为。柔性基板和薄膜的不同组合往往会根据测试条件和界面附着力对测试结果产生不同的影响。薄 MEMS 材料的所需厚度比柔性基板薄 50 倍，而所有其他尺寸均相似。 [外文原描述]： IEC 62047-22:2014 specifies a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates. Conductive thin-film structures on flexible substrates are extensively utilized in MEMS, consumer products, and flexible electronics. The electrical behaviours of films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions. Different combinations of flexible substrates and thin films often lead to various influences on the test results depending on the test conditions and the interfacial adhesion. The desired thickness of a thin MEMS material is 50 times thinner than that of the flexible substrate, whereas all other dimensions are similar to each other.
英文名称Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates