标准摘要
[中文适用范围]： 本部分IEC 62047规定了柔性机电器件在弯曲变形下的电特性测试方法。这些器件包括柔性薄膜上的或嵌入柔性薄膜中的无源微元件和/或有源微元件。该测试方法所需的器件平面尺寸通常在1 mm至300 mm范围内，厚度通常在10 µm至1 mm范围内，但这些并非限制值。该测试方法设计为以准静态方式单调弯曲器件直至最大可能曲率，即直至器件完全折叠，从而获得弯曲变形下电性能的整体退化行为。本文件对于估算特定弯曲变形下的安全裕度至关重要，对于采用这些器件的产品的可靠设计不可或缺。 [外文原描述]： IEC 62047-35:2019 specifies the test method of electrical characteristics under bending deformation for flexible electromechanical devices. These devices include passive micro components and/or active micro components on the flexible film or embedded in the flexible film. The desired in-plane dimensions of the device for the test method ranges typically from 1 mm to 300 mm and the thickness ranges from 10 mm to 1 mm, but these are not limiting values. The test method is so designed as to bend devices in a quasi-static manner monotonically up to the maximum possible curvature, i.e. until the device is completely folded, so that the entire degradation behaviour of the electric property under bending deformation is obtained. This document is essential to estimate the safety margin under a certain bending deformation and indispensable for reliable design of the product employing these devices.
英文名称Semiconductor devices - Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices