半导体器件 微机电器件 第4部分：MEMS的通用规范

[中文适用范围]： 本部分 IEC 62047 规定了由半导体制造的微机电系统 (MEMS) 的通用规范，这些规范是本系列其他部分中针对各种类型 MEMS 应用（如传感器、射频 MEMS、光学 MEMS、生物 MEMS、微 TAS 和功率 MEMS）给出的规范的基础。本文件规定了质量评估的一般程序，并确立了描述和测试电学、光学、机械和环境特性的一般原则。本部分 IEC 62047 有助于制定定义由微加工技术制造的设备和系统的标准，包括但不限于材料表征和处理、组装和测试、过程控制和测量方法。本文档中描述的 MEMS 基本上由半导体材料制成。然而，本文档中的陈述也适用于使用非半导体材料（例如聚合物、玻璃、金属和陶瓷材料）的 MEMS。 [外文原描述]： IEC 62047-4:2026 describes generic specifications for micro-electromechanical systems (MEMS) made by semiconductors, which are the basis for specifications given in other parts of this series for various types of MEMS applications such as sensors, RF MEMS, optical MEMS, bio-MEMS, micro TAS, and power MEMS. This document specifies general procedures for quality assessment and establishes general principles for describing and testing of electrical, optical, mechanical and environmental characteristics. This part of IEC 62047 aids in the preparation of standards that define devices and systems made by micromachining technology, including but not limited to, material characterization and handling, assembly and testing, process control and measuring methods. MEMS described in this document are basically made of semiconductor material. However, the statements made in this document are also applicable to MEMS using materials other than semiconductor, for example, polymers, glass, metals and ceramic materials. This edition includes the following significant technical changes with respect to the previous edition: a) in the Scope, optical MEMS, bio-MEMS, micro TAS, and power MEMS for various types of MEMS applications were included; b) MEMS categories and terms in Table 1 were slightly modified such consumer electronics and automotive were added that in application technology.