标准摘要
[中文适用范围]： IEC 62047-46:2025规定了采用硅基微机电系统（MEMS）中的微加工技术制造的纳米级厚度膜（长度从100μm到5,000μm，宽度从100μm到1,000μm，厚度从50nm到500nm）的拉伸强度测量要求和测试方法。本文件适用于利用微电子技术及相关微加工技术制造的纳米级厚度薄膜的拉伸强度的原位测量。随着器件的规模扩大，由缺陷和污染引起的抗拉强度下降变得更加严重。本文件规定了一种基于MEMS技术的纳米级厚度薄膜拉伸强度的原位测试方法。本文件不需要复杂的仪器（如扫描探针显微镜和纳米压痕仪）和特殊的测试样本。由于本文中的原位片上测试仪与器件采用同一工艺在同一晶圆上制作，因此本文可以为设计部分提供一些实用的参考。 [外文原描述]： IEC 62047-46:2025 specifies the requirements and testing method to measure the tensile strength of membrane with nanoscale thickness (length from 100 μm to 5 000 μm, width from 100 μm to 1 000 μm, thickness from 50 nm to 500 nm) which is fabricated by micromachining technology used in silicon-based micro-electromechanical system (MEMS). This document is applicable to in-situ tensile strength measurement of nanoscale thickness membrane manufactured by microelectronics technology and related micromachining technology. With the devices scaling, the tensile strength degradation, induced by defects and contaminations, becomes severer. This document specifies an in-situ testing method of the tensile strength of membrane with nanoscale thickness based on a MEMS technique. This document does not need intricate instruments (such as scanning probe microscopy and nanoindenter) and special test specimens. Since in-situ on-chip tester in this document and device are fabricated with the same process on the same wafer, this document can give some practical reference for the design part.
英文名称Semiconductor devices - Micro-electromechanical devices - Part 46: Silicon based MEMS fabrication technology - Measurement method of tensile strength of nanoscale thickness membrane