标准摘要
[中文适用范围]： IEC 62137 本部分中描述的测试方法适用于表面安装器件 (SMD) 端子与印刷线路板 (PWB) 上焊盘图案之间的焊点。该测试旨在评估设备（例如手持移动设备）中较大尺寸的多端子元件和其他元件在设备跌落时的焊点强度。评估焊点的特性（例如焊料合金、基材、安装的器件或设计等）以帮助提高焊点的强度。 [外文原描述]： The test method described in IEC 62137-1-3:2008 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.
英文名称Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test